What is the effect of wiping the joint too early during the soldering process?

Wiping the joint too early during the soldering process creates a weaker joint because the soldering material hasn't fully flowed into the joint or achieved the necessary temperature to bond properly. When the joint is disturbed before the solder has cooled and solidified, it can lead to incomplete adhesion between the pipe and fitting. This improper flow of solder can cause gaps or voids within the joint, which compromises its structural integrity and results in a joint that may subsequently leak or fail under pressure. Ensuring the solder remains undisturbed until it has cooled completely is critical for achieving a strong and reliable connection.